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The RFICP100 is a compact gridded ion source product which is well suited for ion beam sputter deposition and ion beam etching. Its ion beam output (> 400mA) is impressive when compared to its compact physical size. The source diameter is 19cm and mounts on a 10” CF flange. It can fit small to medium chamber platforms. In ion beam sputtering, the ion source is outfitted with ion optics which confine the beam to the sputtering target. While in ion beam etching, the ion source is outfitted with ion optics which optimize uniformity. Under the standard configuration, the typical ion energy range is from 100 to 1200eV, while the ion current can exceed 400mA.

DischargeRF Inductive Coupled
- Filament CathodesN/A
- RF Power1kW
Ion OpticsOptiBeam™
- GridsApplication Specific
- AlignmentSelf-aligned
- Beam Size @ Grid10 or 12cm (Typical)
NeutralizerLFN 2000 (Standard)
Power controllerRFICP 1510-2-10-LFNA
- Cathode / NeutralizerLFN2000 or MHC1000 or RFN
- MountRemote or Direct Flange
- Height (Nominal)9.25″
- Diameter (Nominal)7.52″
- Materials ProcessedMetals, Dielectrics, Semiconductors
- Process GasesInert, Reactive, Blends
- Typical Installation Distance6-18″
- Process (Common)Pre-Cleaning, Surface Modification, Ion Beam Assisted Deposition, Ion Beam Etch, Ion Beam Sputter Deposition
- Auto ControllerControls up to 4 Gases with Blending Capabilities and Recipe Storage
- Ion OpticsCollimated, Focused, Defocused

Self-Aligning Grids (OptiBeam™)

The KDC product line incorporates KRI’s patented self-aligned ion optics technology. The OptiBeam™ grids do not require an alignment procedure. Through advanced engineering and precision construction, the straightforward assembly procedure assures the grids are aligned. The benefits of the self-aligning grids includes beam repeatability, extended grid lifetime, maximized ion current, reduced maintenance time and improved uptime.