Processes
KRI’s products are used in a vacuum environment to deposit thin films, dry etch nanostructures, and modify surface properties.
The following table lists common material processes in which KRI products are employed.
| Process Identification | Acronyms |
|---|---|
| In-situ substrate preclean | PC |
| Ion-beam modification of material and surface properties | IBSM |
| Ion-beam-assisted deposition | IBAD |
| - Surface polishing or smoothing | |
| - Surface nanostructures and texturing | |
| - Ion figuring and enhancement | |
| - Ion trimming and tuning | |
| - Surface-activated bonding | SAB |
| Ion-beam-assisted deposition | IBAD |
| Ion-beam etching | IBE |
| - Reactive ion-beam etching | RIBE |
| - Chemically assisted ion-beam etching | CAIBE |
| Ion-beam sputter deposition | IBSD |
| - Reactive ion-beam sputter deposition | RIBSD |
| - Biased target ion-beam sputter deposition | BTIBSD |
| Direct deposition | DD |
| - Hard and functional coatings |
