Gridded RFICP Sources

The RFICP products produce a high density discharge without the use of filaments. The beam extracted from the discharge is precisely controlled to provide a defined shape, current density and ion energy.

Gridded RFICP Sources

Kaufman & Robinson offers a complete product line of radio frequency, inductive coupled plasma (RFICP) gridded ion source products. The RFICP products incorporate our most innovative gridded source technology. Advancements such as the RF filament-less plasma discharge and self-aligned ion optics are proven benefits. Without a filament in the plasma discharge chamber, the RFICP products are suited to operation where reactive gas discharges and long process runs are critical.

The RFICP products come in a comprehensive product package. The package is complete with components required to install and operate the RFICP products, including the RF inductively coupled RFICP ion source, application-specific ion optics, electron source neutralizer, power supply controller, vacuum feedthroughs, and cables.

Our RFICP products are used across the globe in world class research and industrial fabrication of optical, photonics, magnetic and microelectronic devices. The RFICP packages are configurable to suit installation platforms. These configurations can be integrated into numerous vacuum process platforms, including small multi-purpose R&D systems, dedicated planetary motion deposition or etching systems, box coaters, single wafer load-lock cluster tools, and low profile sputtering systems coaters.

The RFICP products are applied in standard and emerging material processes. The ability to produce and control ion species with specific energy, chemical reactivity, current density, and trajectory makes the RFICP products effective tools to engineer precision films and surfaces. Whether its densification, optical transmission, critical thickness uniformity, smooth interfaces, improved adhesion, or vertical sidewalls, the RFICP products are responsible for yielding beneficial material properties. Commonly, the RFICP products are applied in the following vacuum processes:

  • Ion beam assisted deposition in thermal & e-beam evaporation (IBAD)
  • In-situ preclean in sputtering & evaporation (PC)
  • Surface modification and activation (SM)
  • Direct deposition of thin, hard or functional coatings (DD)
  • Ion beam sputter deposition of single and multilayer structures (IBSD)
  • Ion beam etching of surface features in any material (IBE)
  • Ion beam trimming, tuning and figuring of precision devices (IBE)

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ProductRFICP 40RFICP 100RFICP 140RFICP 220
DischargeRF Inductive CoupledRF Inductive CoupledRF Inductive CoupledRF Inductive Coupled
- Filament CathodesN/AN/AN/AN/A
- RF Power0.6kW1kW1kW2kW
Ion OpticsOptiBeam™OptiBeam™OptiBeam™OptiBeam™
- GridsApplication SpecificApplication SpecificApplication SpecificApplication Specific
- AlignmentSelf-alignedSelf-alignedSelf-aligned
- Beam Size @ Grid4cm (Typical)10 or 12cm (Typical)14cm (Typical)22cm (Typical)
NeutralizerLFN 2000 (Standard)LFN 2000 (Standard)LFN 2000 (Standard)LFN 2000 (Standard)
Power controllerRFICP 1510-2-06-LFNARFICP 1510-2-10-LFNARFICP 1510-2-10-LFNARFICP 1510-2-10-LFNA
Configurations
- Cathode / NeutralizerLFN1000 or MHC1000 or RFNLFN2000 or MHC1000 or RFNLFN2000 or MHC1000 or RFNLFN2000 or MHC1000 or RFN
- MountRemote or Direct FlangeRemote or Direct FlangeRemote or Direct FlangeRemote or Direct Flange
- Height (Nominal)5.0″9.25″9.8″11.8″
- Diameter (Nominal)5.3″7.52″9.8″16.1″
- Materials ProcessedMetals, Dielectrics, SemiconductorsMetals, Dielectrics, SemiconductorsMetals, Dielectrics, SemiconductorsMetals, Dielectrics, Semiconductors
- Process GasesInert, Reactive, BlendsInert, Reactive, BlendsInert, Reactive, BlendsInert, Reactive, Blends
- Typical Installation Distance6-18″6-18″8-36″8-45″
- Process (Common)Pre-Cleaning, Surface Modification, Ion Beam Assisted Deposition, Ion Beam Etch, Ion Beam Sputter DepositionPre-Cleaning, Surface Modification, Ion Beam Assisted Deposition, Ion Beam Etch, Ion Beam Sputter DepositionPre-Cleaning, Surface Modification, Ion Beam Assisted Deposition, Ion Beam Etch, Ion Beam Sputter DepositionPre-Cleaning, Surface Modification, Ion Beam Assisted Deposition, Ion Beam Etch, Ion Beam Sputter Deposition
- Auto ControllerControls up to 4 Gases with Blending Capabilities and Recipe StorageControls up to 4 Gases with Blending Capabilities and Recipe StorageControls up to 4 Gases with Blending Capabilities and Recipe StorageControls up to 4 Gases with Blending Capabilities and Recipe Storage
- Ion OpticsCollimated, Focused, DefocusedCollimated, Focused, DefocusedCollimated, Focused, DefocusedCollimated, Focused, Defocused

Self-Aligning Grids (OptiBeam™)

The KDC product line incorporates KRI’s patented self-aligned ion optics technology. The OptiBeam™ grids do not require an alignment procedure. Through advanced engineering and precision construction, the straightforward assembly procedure assures the grids are aligned. The benefits of the self-aligning grids includes beam repeatability, extended grid lifetime, maximized ion current, reduced maintenance time and improved uptime.