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The compact and efficient eH400 is ideally suited to provide cost-effective, high-current ion beams for small to medium sized vacuum systems. It is commonly used for ion assist, precleaning, and low energy etching.

  • Dimensions: diameter = 3.7" height = 3"
  • Discharge Voltage/Current: 50-300eV/5 A
  • Operating Gases: Ar, Xe, Kr, O2, N2, Organic Precursors

Features & Benefits

  • Removable Anode Assembly
    • Ease of maintenance
    • Minimizes down-time during maintenance
    • Plug-and-play spare anode
  • Broad-Beam High Discharge Current
    • Uniform etch rates
    • High etch rate
    • High ion assist deposition (IAD) rates
  • Versatile
    • Load lock/Ultra High Vacuum (UHV) compatible
    • Small footprint
  • Cost Efficient
    • Lower cost per mA/cm2 than gridded sources
    • Low maintenance cost
  • Efficient plasma conversion and stable power control


  • IAD
  • Load lock preclean
  • In-situ preclean
  • Low-energy etching
  • III-V Semiconductors
  • Polymer Substrates